Measurements and Analytical

LightCube offers its R&D facilities and know-how to companies willing to measure, analyze and develop their products. LightCube offer a full range of instrumentation and technical support to ensure that our customer products reach their requirements

Photometric measurement

Photometric measurement (1)

Integrating Sphere measurement (65” 4pi integration)

IESNA LM-79 Standard measurement

  • Optical power [W]
  • Luminous Flux [lm]
  • Absolute emitted spectra (350 – 1100 nm) [μW/nm]
  • Color Coordinates (x, y, u’, v’)
  • Correlated Color Temperature [K]
  • Color Rendering Index [Ra and single indexes R1 – R14]
  • Luminous Efficacy [lm/W]
  • Optical Efficiency [% loss with optics]

Active Thermal Control of the light source

  • Optical measurements performed at different temperatures (0°C – 115 °C)
  • Thermal control for single LEDs and boards of up to 100 x 100mm in size
Photometric measurement

Photometric measurement (2)

Irradiance measurement

Measurement by Calibrated Cosine corrected Spectrometer

  • Optical power density [W/cm2]
  • Luminous Intensity [lux - footcandle]
  • Irradiance spectra (350 – 1100 nm) [μW/nm cm2]

Photogoniometer measurement

2m Type A photogoniometer

0.3m Type C photogoniometer

  • Intensity distribution and spatial color uniformity
  • Eulumdat & IES fileformat measurement

Photogoniometer measurement

  • Near UV and Blue radiation hazard according to the IEC62471 standard.
Thermal measurement

Thermal measurement

Measurement by calibrated thermocouple

  • Base plate measurement
  • Temperature of the Tc point
  • Self-heating transient at Tc point

Thermal imaging

Measurement by scientific-grade IR camera

  • Thermal measurement of the entire system at a glance
  • Temperature distribution
  • Study of thermal operating conditions of different LEDs on the same system
  • Analysis of the thermal distribution between LEDs, PCB board, heatsink
Advanced Thermal Characterization

Advanced Thermal Characterization

Thermal-mapping and heating transient measurement

  • Variation of electrical characteristics with operating temperature
  • Junction temperature measurement
  • Real Thermal resistance of the LEDs
  • Characterization of the thermal resistance of different IMS Board
Failure Analysis

Failure Analysis

The combinations of advanced analyzing techniques and scientific know-how allows the identification of the different failure mechanism on LED systems.


Available techniques are:

  • Deprocessing / Decapsulation
  • Optical / SEM microscope
  • Electrical / capacitive
  • Localized defect analysis
  • Defect identification
Reliability study

Reliability study

All the failure analysis techniques may be paired and performed during stress test of the LED samples. Degradation mechanisms and lifetime models are extracted by means of accelerated stress analysis.

Degradation mechanisms and lifetime models are extracted by means of accelerated stress analysis.

  • Isocurrent/Isothermal stress
  • Humidity testing
  • ESD testing
  • Hot plugging
  • TM21 LM80 testing
  • Humidity testing
  • Custom conditions / event